Home
Failure Analysis
Destructive Physical Analysis
Product Analysis / Reverse Engineering
Environmental Testing / Parts Procurement
Capabilities
Contacts
Sample Reports
Technical Articles
Quality Policy
Careers
|
|
Capital Equipment
SEM Labs
-Hitachi S-4700 FESEM (2)
-JEOL 845IC
-ABT 32
-EDS (Noran Light Element)
(2)-IDS5000
-Probe Stage
-EBIC Amplifiers(3)
-Cathodoluminescence
-Auto Photo Stitching Sofware
Specialty Inspection labs
-Focused Ion Beam (NP Test FIB)
-Atomic Foce Microscope
(Veeco Dimension 3100)
-Light Emission Analysis
(Hypervision / Probe Stage)
-Laser Cutting
-Real Time X-Radiography
(Fein Focus-Tiger)
-Scanning Acoustic Microscopy
(Sonix)
-Low and High Power Optical (12)
Mechanical Test Lab
-Wire Pull / Die Shear Stations
-Particle Impact Noise Detection
-Fine and Gross Leak Testers
-Chip Assembly (Die and Wire Bond)
Environmental Test Lab
-Temperature Cycle Chambers
-HAST Chambers
-Thermal Shock Chambers
-Burn-in Ovens
-85/85 Chambers
-Various Electrical Test Equipment
Metallurgical Lab
-Polishing Wheels (9)
-Precision Parallel Lapping (2)
-Jet Etch Machines (3)
-Wet / Dry Etching (2)
|
|
|
Analysis Techniques
SEM Labs
-Backscattered Electron Imaging
-SEM Inspection
-Material Identification
-EBIC Failure Isolation
-Static Voltage contrast
-Dynamic Voltage Contrast
-Electron Beam Induced Current Imaging
-Crystallographic Defect Isolation
-SEM Photo to GDSII Conversion
Specialty Inspection labs
-On Chip Die Modification
-Insulator / Metal Deposition
-Precision Cross Sections
-High Resolution Imaging
-SCM and SRM Imaging
-Failure Site Isolation
-Dielectric Luminescence / Thermal Radiation
-Circuit Isolation
-PEM Non-invasive Inspections
-Hermetic Non-invasive Inspections
-Delamination / Voiding Detection
-Up-Screening Inspections / Qual Testing
Mechanical Test Lab
-DPA / CA Service Support
-FA Service Support
-Parts Procurement Service Support
-Up-Screening Inspection
Environmental Test Lab
-PEM Qualification Testing
-Parts Procurement Service Support
-Up-Screening Inspections
-COTS Performance Evaluation
-Moisture Sensitivity Classification
-Electro-Static Dischage Classification
Metallurgical Lab
-Plastic Part Decapsulation
-Die and Package Cross Section
-Passivation / Metal Removal
-Precision Layer Removal (Parallel Lapping)
-Electronic Part Cross Sectioning
(Connectors, Resistors, Capacitors...)
|
