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Failure Analysis
Destructive Physical Analysis
Product Analysis / Reverse Engineering
Environmental Testing / Parts Procurement
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Capital Equipment
SEM Labs
-Hitachi S-4700 FESEM (2)
-JEOL 845IC -ABT 32 -EDS (Noran Light Element) (2)-IDS5000 -Probe Stage -EBIC Amplifiers(3)
-Cathodoluminescence -Auto Photo Stitching Sofware
Specialty Inspection labs
-Focused Ion Beam (NP Test FIB) -Atomic Foce Microscope (Veeco Dimension 3100)
-Light Emission Analysis (Hypervision / Probe Stage) -Laser Cutting
-Real Time X-Radiography (Fein Focus-Tiger) -Scanning Acoustic Microscopy
(Sonix) -Low and High Power Optical (12)
Mechanical Test Lab
-Wire Pull / Die Shear Stations -Particle Impact Noise Detection -Fine and Gross Leak Testers
-Chip Assembly (Die and Wire Bond)
Environmental Test Lab
-Temperature Cycle Chambers -HAST Chambers -Thermal Shock Chambers -Burn-in Ovens
-85/85 Chambers -Various Electrical Test Equipment
Metallurgical Lab
-Polishing Wheels (9) -Precision Parallel Lapping (2) -Jet Etch Machines (3) -Wet / Dry Etching (2)
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Analysis Techniques
SEM Labs
-Backscattered Electron Imaging -SEM Inspection -Material Identification -EBIC Failure Isolation
-Static Voltage contrast -Dynamic Voltage Contrast -Electron Beam Induced Current Imaging
-Crystallographic Defect Isolation -SEM Photo to GDSII Conversion
Specialty Inspection labs
-On Chip Die Modification -Insulator / Metal Deposition -Precision Cross Sections
-High Resolution Imaging -SCM and SRM Imaging -Failure Site Isolation -Dielectric Luminescence / Thermal Radiation
-Circuit Isolation -PEM Non-invasive Inspections -Hermetic Non-invasive Inspections
-Delamination / Voiding Detection -Up-Screening Inspections / Qual Testing
Mechanical Test Lab
-DPA / CA Service Support -FA Service Support -Parts Procurement Service Support -Up-Screening Inspection
Environmental Test Lab
-PEM Qualification Testing -Parts Procurement Service Support -Up-Screening Inspections
-COTS Performance Evaluation -Moisture Sensitivity Classification -Electro-Static Dischage Classification
Metallurgical Lab
-Plastic Part Decapsulation -Die and Package Cross Section -Passivation / Metal Removal -Precision Layer Removal (Parallel Lapping)
-Electronic Part Cross Sectioning (Connectors, Resistors, Capacitors...)
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